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500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

China ASLi (CHINA) TEST EQUIPMENT CO., LTD certification
China ASLi (CHINA) TEST EQUIPMENT CO., LTD certification
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500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

Large Image :  500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control

Product Details:
Place of Origin: China
Brand Name: ASLI
Certification: CE , ISO , SGS
Model Number: RHD-45
Payment & Shipping Terms:
Minimum Order Quantity: 1 set
Price: Negotiate
Packaging Details: standard wooden case
Delivery Time: 15 workdays
Payment Terms: T/T, Western Union
Supply Ability: negotiate
Detailed Product Description
Internal Dimension: W450×H400×D400mm Temp. Control Accuracy: +/-0.5℃
Heating Medium: Electric Heating Tube Current Controller: SSR
Max. Temperature: 500C Control Method: PID Control
Application: IC Packaging Power: AC380V
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500C Hot Air High Temperature Drying Oven for IC Packaging with PID Control
 
 
Product Description
 

High Temperature Drying Oven can provide a stable test space for pre-heating, drying, changes about physics and chemistry testing. It supplys precision temperature controllter with high stability of platinum resistance to temperature that makes temperature well-distribution.

 

 

Name
High Temperature Oven
Model
RHD - 45
RHD - 60
RHD - 90
Internal Dimension W×H×D(mm )
450×400×400
500×600×500
600×900×500
External Dimension W×H×D(mm )
650×900×550
700×1200×650
850× 1600×700
Interior and Exterior Material
Interior material is SUS 304# stainless steel,
exterior is stainless steel or SEE cold-rolled steel with paint coated.
Temperature Range
(RT+15C) to 200C; (300 to 500℃ is optional)
Indication Resolution/ Distribution Uniformity
0.1℃/±2.0℃;( When temperature is 100℃)
Temperature Rising Velocity
Temperature rising velocity: from R.T. to 200℃,needs approx. 35mins
 

 

500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control 0

 

500C Hot Air High Temperature Drying Oven Specifications

 

1. Outside SECC steel, fine powder coating treatment; Inner SUS#304 stainless steel.
2. Use new high temperature resistant long shaft motor
3 Turbine fan.
4. Silicone forced tight.
5. Overtemperature protection, super load automatic power system.
6. Circulation system: air force level cycle.
7. Heating system:PID+S.S.R.
8. The thermostat: PID microcomputer control, automatic constant temperature, temperature quickly compensation function
9. Timer: temperature to time, when the power failure alarm indication.
10. According to customer demand matching glass window can be customized according to customer specifications specified.

 

 

Detailed Images
500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control 1500C Hot Air High Temperature Drying Oven For IC Packaging With PID Control 2
 

 

If you need more information about 500C Hot Air High Temperature Drying Oven for IC Packaging with PID Control, please don't hesitate to contact us. 

Contact Details
ASLi (CHINA) TEST EQUIPMENT CO., LTD

Contact Person: Lily Chen

Tel: +8613543715035

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